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PCB Layout Guidelines and Tips for a Successful Layout

Here are a few suggestions and guidelines we use to insure quality, quick turnaround, and ultimately a superior product.

P.D.C.'s main strength lies in its technical expertise in all phases of circuit board production from concept design to fabrication to finished product assembly. P.D.C. has the unique advantage of understanding every phase of a given project and how each may affect the other. 

Our goal is to help our customers get their products out faster and better. In today's world, speed is essential, but so is getting the job done right the first time - "time to market". We have dedicated ourselves to provide first rate quality, customer service and on-time deliveries. Please call us, we will show you how our solution can help you!

PCB Layout measurement suggestions

The following Design Standards have evolved over many years of PCB production. In our opinion, they offer the best compromise between design and manufacturing. Fast paced development cycles, poorly used auto-routers and unseasoned PCB Layout Designers can run up cost tremendously. By using these standards, your board manufacturer will get better yields out of a product run and can save you a fortune over time. (THIS IS AN OLD TECHNOLOGY TABLE !!!!)

GRID .020 or 8.333 for thru-hole parts .005, .010 or .025 for surface mount
PIN 1 ON COMPONENTS .055 SQ. (Comp & Solder Side)
COMPONENT PADS .055 RD. min. of .020 larger than hole size
COMPONENT HOLES .033 +/-.003, .039 +/-.003 for .025 sq. pins (e.g. Headers, Connectors)
SOLDERMASK PADS .065 (.010 larger for wet mask, .005 for dry or L.P.I.
PADS PLANE CLEARANCE .085 min or .030 larger than hole size. Do not use a pad within a clearance. Remove unused pads on internal line layers. The potential for shorts will be greatly reduced.
THRU-HOLE VIA PADS .050 Rd.
THRU-HOLE VIA HOLE .028 +/- .003 separate tool number for easy removal for later test fixture use.
SMT VIA PADS .028 min., .042 preferred
SMT VIA HOLES .012 min., .022 preferred
BOARD EDGE PULL BACK ON PLANES .050
BOARD EDGE PULL BACK ON SOLDERMASK .025 keep circuitry .050 from board edge.
SIGNAL TRACE .008 (.012 on loose boards)
PWR & GND TRACES .050
LINE TO LINE SPACING .007 (.013 on loose boards)
LINE TO PAD SPACING .007 on SMT, .008 on thru-hole
PAD TO PAD SPACING .025 Pad to via and pad to pad spacing should be sufficient to insure soldermask coating between pads. Soldermasks are bigger, so allow enough room between pads for a minimum of .015 coverage.
PAD TO VIA CENTERS .080
TEXT HEIGHT .075 min.
TEXT LINE WIDTH .008 min.
PART OUTLINE WIDTH .012 min.

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